Electroless Nickel Plating Chemical Reduction
Electroless Nickel Plating (ENP) may be the deposit of a nickel-alloy coating by chemical reduction - devoid of the electric present that’s utilized in electroplating processes. The majority of ENP for engineering purposes is usually a nickel phosphorus deposit containing two to 14% phosphorus. The larger the phosphorus content the greater the corrosion resistance, nonetheless the compromise on elevated phosphorus content material is usually a decrease in hardness. ENP is deposited by decreasing nickel ions to metallic nickel having a chemical reducing agent like sodium hydrophosphite. Thickness of 25-75m is common, high phosphorus ENP can edge above 75m while this does commence to push the limits of ENP. Added Benefits of Electroless Nickel Plating ENP delivers great corrosion resistance to popular corrodents for example salt water, carbon dioxide, oxygen and hydrogen sulphide. High phosphorus deposits of ENP (10-14% phos) is also amorphous, which means that you can find no grain o